Title:
HEAT-RESISTANT SILANE-CROSS-LINKABLE RESIN-MOLDED ARTICLE, HEAT-RESISTANT SILANE-CROSS-LINKABLE RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, HEAT-RESISTANT PRODUCT USING HEAT-RESISTANT SILANE-CROSS-LINKABLE RESIN-MOLDED ARTICLE, AS WELL AS SILANE COUPLING AGENT PREMIXED FILLER AND FILLER CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2014/188925
Kind Code:
A1
Abstract:
A manufacturing method having a step (a) for melting and mixing 0.01 to 0.6 parts by mass of an organic peroxide (P) with respect to 100 parts by mass of a resin composition (RC), and 10 to 400 parts by mass of a filler (S) containing a silane coupling agent premixed filler (F) in which the heat-loss ratio (W) excluding moisture when heated for two hours at 105°C is 0.15 to 3.0 mass%, at a dissolution temperature or greater of the organic peroxide (P) to prepare a silane master batch; a heat-resistant silane-cross-linkable resin-molded article and heat-resistant silane-cross-linkable resin composition manufactured using this manufacturing method; a heat-resistant product that uses the heat-resistant silane-cross-linkable resin-molded article; a silane coupling agent premixed filler; and filler containing same.
Inventors:
NISHIGUCHI MASAKI (JP)
MATSUMURA ARIFUMI (JP)
MATSUMURA ARIFUMI (JP)
Application Number:
PCT/JP2014/062813
Publication Date:
November 27, 2014
Filing Date:
May 14, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C08J5/10; C08J3/22; C08K5/14; C08K9/06; C08L101/00; G02B6/44; H01B3/44; H01B7/02; H01B13/14
Domestic Patent References:
| WO2013147148A1 | 2013-10-03 |
Foreign References:
| JP2001302234A | 2001-10-31 | |||
| JP2012149163A | 2012-08-09 | |||
| JP2008297453A | 2008-12-11 | |||
| JP2000212291A | 2000-08-02 | |||
| JP2013227559A | 2013-11-07 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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