Title:
HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1996/015192
Kind Code:
A1
Abstract:
A heat-resistant thermoplastic resin composition comprising 5-95 parts by weight of a polyamide resin (A), 5-95 parts by weight of an unsaturated carboxylic acid copolymer (B) comprising 40-80 wt.% of an aromatic vinyl compound, 15-50 wt.% of a vinyl cyanide compound, 0.1-20 wt.% of an unsaturated carboxylic acid compound and 0-30 wt.% of other copolymerizable vinyl compound, and 5-50 parts by weight of a graft copolymer (C) prepared by grafting 60-5 wt.% of a vinyl compound onto 40-95 wt.% of a diene rubber having an average particle diameter of 0.1-2.0 'mu'm, which composition further contains kaolin (D) in an amount of 0.1-30 parts by weight per 100 parts by weight in total of the components (A), (B) and (C). The composition provides moldings excellent in thermal deformation and impact resistances and appearance, and has a good flowability in molding.
Inventors:
YAMASHITA KOICHI (JP)
KOBAYASHI HIROSHI (JP)
ASADA MASAHIRO (JP)
KOBAYASHI HIROSHI (JP)
ASADA MASAHIRO (JP)
Application Number:
PCT/JP1995/002261
Publication Date:
May 23, 1996
Filing Date:
November 07, 1995
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND (JP)
YAMASHITA KOICHI (JP)
KOBAYASHI HIROSHI (JP)
ASADA MASAHIRO (JP)
YAMASHITA KOICHI (JP)
KOBAYASHI HIROSHI (JP)
ASADA MASAHIRO (JP)
International Classes:
C08F279/02; C08L25/12; C08L51/00; C08L51/04; C08L55/00; C08L55/02; C08K3/34; C08L73/00; C08L77/00; (IPC1-7): C08L77/00; C08L25/02; C08L33/18; C08L51/04; C08K3/34; C08K7/18
Foreign References:
| JPH04161456A | 1992-06-04 | |||
| JPH0326745A | 1991-02-05 | |||
| JPS61130368A | 1986-06-18 | |||
| JPH01141941A | 1989-06-02 | |||
| JPH01141940A | 1989-06-02 | |||
| JPH0273841A | 1990-03-13 |
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