Title:
HEAT-RESPONSIVE SWITCH ELEMENT, AND ELECTRIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2022/149475
Kind Code:
A1
Abstract:
A heat-responsive switch element 1 is provided with: a fixed contact 21; a movable piece 4 which presses a movable contact 41 into contact with the fixed contact 21; and a heat-responsive element 5 which causes the movable piece 41 to deform elastically to move the movable contact 41 away from the fixed contact 21, and which deforms in response to a change in temperature, thereby causing the movable piece 4 to operate in such a way that the movable contact 41 comes into contact with the fixed contact 21. The heat-responsive element 5 includes a first layer 51 having a first coefficient of thermal expansion, and a second layer 52 having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion. The first layer 51 is arranged on the fixed contact 21 side and the second layer 52 is arranged on the movable contact 4 side in the thickness direction of the heat-responsive element 5.
Inventors:
MIYATA KEITARO (JP)
Application Number:
PCT/JP2021/047674
Publication Date:
July 14, 2022
Filing Date:
December 22, 2021
Export Citation:
Assignee:
BOURNS KK (JP)
International Classes:
H01H37/54
Foreign References:
| JPS63187520A | 1988-08-03 | |||
| JP2017103118A | 2017-06-08 | |||
| JP2018190514A | 2018-11-29 | |||
| JP2005149724A | 2005-06-09 |
Attorney, Agent or Firm:
SUMITOMO SHINTARO (JP)
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