Title:
HEAT-RETAINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022065
Kind Code:
A1
Abstract:
In the present invention, a heat-retaining device comprises a heat source body (50, 51), a case (61), and a heat-dissipation-amount-reducing part (67, 68). The case secures and houses the heat source body so that a space is formed between the case and the heat source body. The heat-dissipation-amount-reducing part reduces the amount of heat released into the case from the heat source body through the space. According to this configuration, providing the heat-dissipation-amount-reducing part makes it possible to reduce the amount of heat released into the case from the heat source body through the space. Accordingly, the heat insulation performance of the heat source body can be increased, which makes it possible to improve the heat retention performance of the heat source body.
Inventors:
HAYASE TOMOHIRO (JP)
AKITA KENJI (JP)
FUSE TAKUYA (JP)
AKITA KENJI (JP)
FUSE TAKUYA (JP)
Application Number:
PCT/JP2019/027362
Publication Date:
January 30, 2020
Filing Date:
July 10, 2019
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01M10/658; F28D20/02; H01M10/615; H01M10/6569; H01M50/204; H01M50/224; H01M50/227; H01M50/271
Foreign References:
| JPS6273579A | 1987-04-04 | |||
| JP2015002108A | 2015-01-05 | |||
| JPH1032021A | 1998-02-03 | |||
| JP2016105365A | 2016-06-09 |
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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