Title:
HEAT-SCHRINKABLE FILM
Document Type and Number:
WIPO Patent Application WO/2004/033541
Kind Code:
A1
Abstract:
A heat-shrinkable film and a heat-shrinkable multi-layer film which are prepared from a resin composition which comprises an aromatic vinyl compound-conjugated diene block copolymer having a microphase separated structure comprising a soft phase and a hard phase and further having a specific structure and preferably exhibiting a specific dynamic viscoelasticity spectrum and a styrene polymer having a syndiotactic structure, in a specific ratio. The heat-shrinkable film or a heat-shrinkable multi-layer film offers an excellent balance of heat resistance, high shrinkability especially at a low temperature, the resistance to natural shrinking, chemical resistance and rigidity.
Inventors:
SUZUKI SHIGERU (JP)
ODA TAKESHI (JP)
SHIMIZU NORIHIRO (JP)
ODA TAKESHI (JP)
SHIMIZU NORIHIRO (JP)
Application Number:
PCT/JP2003/012899
Publication Date:
April 22, 2004
Filing Date:
October 08, 2003
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SUZUKI SHIGERU (JP)
ODA TAKESHI (JP)
SHIMIZU NORIHIRO (JP)
SUZUKI SHIGERU (JP)
ODA TAKESHI (JP)
SHIMIZU NORIHIRO (JP)
International Classes:
B29C61/06; B32B27/28; C08J5/18; C08L53/02; C08L25/06; (IPC1-7): C08J5/18; B29C61/06; B32B27/28; C08L53/02
Domestic Patent References:
| WO2002038642A1 | 2002-05-16 |
Foreign References:
| JPH1058540A | 1998-03-03 | |||
| JPH0732468A | 1995-02-03 | |||
| JPH0720785A | 1995-01-24 | |||
| JPH09286884A | 1997-11-04 | |||
| JPH0623820A | 1994-02-01 | |||
| JPH11349704A | 1999-12-21 | |||
| JPH10176069A | 1998-06-30 |
Other References:
See also references of EP 1550690A4
Attorney, Agent or Firm:
Senmyo, Kenji (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo, JP)
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