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Patent Searching and Data


Title:
HEAT SEAL MODIFIERS FOR LINEAR POLYETHYLENES
Document Type and Number:
WIPO Patent Application WO2005059024
Kind Code:
A3
Abstract:
The present invention is linear polyethylene composition suitable for use as a heat seal resin, wherein the resin comprises: (a) from about 70 wt % to about 90 wt % of a linear polyethylene having a density of from about 0.88 to about 0.92 g/cm<3>; (b) from about 0 wt % to about 30 wt % of a copolymer of ethylene and an alpha,beta-unsaturated carboxylic acid and/or an ionomer thereof; and, (c) from about 2 wt % to about 10 wt % of a tackifier.

Inventors:
LENGES GERALDINE M (US)
LIBERT TIMOTHY A (US)
Application Number:
PCT/US2004/043064
Publication Date:
September 15, 2005
Filing Date:
December 16, 2004
Export Citation:
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Assignee:
DU PONT (US)
LENGES GERALDINE M (US)
LIBERT TIMOTHY A (US)
International Classes:
C08F8/00; C08K3/00; C08L23/08; (IPC1-7): C08L23/08; C08K3/00
Foreign References:
EP1344642A22003-09-17
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31)
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