Title:
HEAT-SEALING AGENT, HEAT-SEALABLE FILM, AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/243417
Kind Code:
A1
Abstract:
Provided are: a heat-sealing agent having a modified polyolefin and an organic solvent, wherein the modified polyolefin is a maleic acid-modified polyolefin, the IR absorption ratio of maleic acid to polypropylene in the modified polyolefin is 0.2-0.5, and the molecular weight distribution of the modified polyolefin is at least 3.5; a heat-sealable film comprising said heat-sealing agent disposed on a substrate; and a packaging material using said heat-sealable film. It is preferable that the modified polyolefin has a weight average molecular weight of at least 100,000.
Inventors:
NAKAMURA MAKOTO (JP)
OHARA SHIN-ICHI (JP)
FUJINO KOJI (JP)
KOUYAMA TATSUYA (JP)
OHARA SHIN-ICHI (JP)
FUJINO KOJI (JP)
KOUYAMA TATSUYA (JP)
Application Number:
PCT/JP2023/020482
Publication Date:
December 21, 2023
Filing Date:
June 01, 2023
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09K3/10; B32B27/00; C08J7/052
Domestic Patent References:
| WO2021131865A1 | 2021-07-01 |
Foreign References:
| JP2004277617A | 2004-10-07 | |||
| JPS62285927A | 1987-12-11 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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