Title:
HEAT SEALING FILM, VALVE DEVICE WITH HEAT SEALING FILM, ELECTRICITY STORAGE DEVICE, VALVE STRUCTURE FOR ELECTRICITY STORAGE DEVICE, AND METHOD FOR MANUFACTURING VALVE STRUCTURE FOR ELECTRICITY STORAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/138985
Kind Code:
A1
Abstract:
A heat sealing film for bonding a receiving body and a valve device together, the heat sealing film comprising a heat-resistant resin layer having a melting peak temperature within a range of 150-350°C inclusive, wherein heat shrinkage rates in MD and TD when heated in a 200°C environment for 10 minutes are 7.0% or less.
Inventors:
SASAKI MIHO (JP)
Application Number:
PCT/JP2021/048704
Publication Date:
June 30, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
F16K27/00; H01G9/00; H01G9/12; H01G11/14; H01G11/84; H01M50/184; H01M50/198; H01M50/342
Foreign References:
| JP2020095977A | 2020-06-18 | |||
| JP2019217700A | 2019-12-26 | |||
| JP2017120790A | 2017-07-06 | |||
| JP2019207859A | 2019-12-05 | |||
| JP2020056445A | 2020-04-09 | |||
| JP2020184417A | 2020-11-12 | |||
| JPH03141552A | 1991-06-17 | |||
| JP4892842B2 | 2012-03-07 | |||
| JP6359731B1 | 2018-07-18 | |||
| JP2016031934A | 2016-03-07 |
Attorney, Agent or Firm:
TACHIBANA, Kenji (JP)
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