Title:
HEAT-SENSITIVE ADHESIVE AND HEAT-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2010/092906
Kind Code:
A1
Abstract:
The disclosed heat-sensitive adhesive comprises a side chain crystalline polymer and exhibits adhesive strength at temperatures above the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed of a crosslinked polymer obtained by adding a metal chelate compound to the side chain crystalline polymer and carrying out a crosslinking reaction. The side chain crystalline polymer crystallizes at a temperature less than the melting point and demonstrates fluidity at temperatures above the melting point. The disclosed heat-sensitive adhesive tape is provided with an adhesive layer composed of the heat-sensitive adhesive on one or both sides of a base material film.
Inventors:
NANCHI MINORU (JP)
KAWAHARA SHINICHIRO (JP)
KAWAHARA SHINICHIRO (JP)
Application Number:
PCT/JP2010/051683
Publication Date:
August 19, 2010
Filing Date:
February 05, 2010
Export Citation:
Assignee:
NITTA CORP (JP)
NANCHI MINORU (JP)
KAWAHARA SHINICHIRO (JP)
NANCHI MINORU (JP)
KAWAHARA SHINICHIRO (JP)
International Classes:
C09J201/00; C09J7/22; C09J7/35; C09J11/06; C09J133/04
Foreign References:
| JP2005336680A | 2005-12-08 | |||
| JP2003147300A | 2003-05-21 | |||
| JP2008179744A | 2008-08-07 | |||
| JP2000355684A | 2000-12-26 | |||
| JP2001127012A | 2001-05-11 | |||
| JP2005260187A | 2005-09-22 | |||
| JPH06510548A | 1994-11-24 | |||
| JPH04507425A | 1992-12-24 |
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
Toshikazu Fukai (JP)
Toshikazu Fukai (JP)
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