Title:
HEAT-SHIELDING HEAT INSULATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/181433
Kind Code:
A1
Abstract:
Provided is a heat-shielding heat insulating substrate that has excellent scratch resistance. This heat-shielding heat insulating substrate comprises a transparent substrate layer and an infrared reflection layer, and is provided with: an undercoat layer between the transparent substrate layer and the infrared reflection layer, and a protective topcoat layer on the opposite side of the transparent substrate layer of the infrared reflection layer. The thickness of the undercoat layer is 0.01 μm-5 μm, the thickness of the protective topcoat layer is 5 nm-500 nm, the hardness of the undercoat layer is 0.50 GPa or greater, and the hardness of the protective topcoat layer is 0.50 GPa or greater.
Inventors:
WATANABE MASAHIKO (JP)
SHIMAZAKI YUTA (JP)
BEPPU HIROSHI (JP)
YAMAMOTO YUSUKE (JP)
KONTANI TOMOHIRO (JP)
SHIMAZAKI YUTA (JP)
BEPPU HIROSHI (JP)
YAMAMOTO YUSUKE (JP)
KONTANI TOMOHIRO (JP)
Application Number:
PCT/JP2018/012658
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/02
Domestic Patent References:
| WO2016021532A1 | 2016-02-11 |
Foreign References:
| JP2013521160A | 2013-06-10 | |||
| JPH063523A | 1994-01-14 | |||
| JPH01301537A | 1989-12-05 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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