Title:
HEAT-SHIELDING HEAT INSULATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/181444
Kind Code:
A1
Abstract:
Provided is a heat-shielding heat insulating substrate that has excellent scratch resistance. This heat-shielding heat insulating substrate comprises a transparent substrate layer and an infrared reflection layer, and is provided with: a topcoat layer and a protective topcoat layer on the opposite side of the transparent substrate layer of the infrared reflection layer. The topcoat layer is any one of an oxide or a nitride, an oxynitride, or a non-oxynitride containing one or more of Group 13 or 14 of the periodic table as a main component, and includes one or more components of Group 3 or 4 of the periodic table, wherein the protective topcoat layer includes a coordination-coupled material.
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Inventors:
WATANABE MASAHIKO (JP)
SHIMAZAKI YUTA (JP)
BEPPU HIROSHI (JP)
KATO DAIKI (JP)
YAMAMOTO YUSUKE (JP)
SHIMAZAKI YUTA (JP)
BEPPU HIROSHI (JP)
KATO DAIKI (JP)
YAMAMOTO YUSUKE (JP)
Application Number:
PCT/JP2018/012679
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B9/00; G02B5/26
Domestic Patent References:
| WO2016021532A1 | 2016-02-11 |
Foreign References:
| JPH03223703A | 1991-10-02 | |||
| JP2001033622A | 2001-02-09 | |||
| JPH0952733A | 1997-02-25 | |||
| JP2015229614A | 2015-12-21 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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