Title:
HEAT-SHRINK FILM
Document Type and Number:
WIPO Patent Application WO/2018/180598
Kind Code:
A1
Abstract:
Provided is a polystyrene heat-shrink film having enhanced film stability during storage, compared with conventional polystyrene heat-shrink films, while still being provided with an excellent shrink finish, ease of separation at perforations, and ease of adhesion. The present invention is a heat-shrink film containing a polystyrene resin. The heat-shrink film has: a thermal shrinkage of 15% or less in a main shrinkage direction when being immersed in 70°C water for 10 seconds; a thermal shrinkage of 60% or more in the main shrinkage direction when being immersed in 98°C water for 10 seconds; an Elmendorf tear strength within the range of 3-10 N/mm in the main shrinkage direction; an Elmendorf tear strength within the range of 10-20 N/mm in a direction orthogonal to the main shrinkage direction; a shrinkage stress of 4.0 N/mm2 or less in the main shrinkage direction when being left at 85°C for five minutes; and a shrinkage factor of 1.5% or less in the main shrinkage direction when being left at 40°C for seven days.
Inventors:
KANZAKA YUICHIRO (JP)
KANEKO TAKUMA (JP)
YUGE SHUUTA (JP)
WATANABE MASAHIRO (JP)
KANEKO TAKUMA (JP)
YUGE SHUUTA (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2018/010468
Publication Date:
October 04, 2018
Filing Date:
March 16, 2018
Export Citation:
Assignee:
C I TAKIRON CORP (JP)
International Classes:
B29C61/06; B29K105/02
Domestic Patent References:
| WO2008075707A1 | 2008-06-26 |
Foreign References:
| JP2003340987A | 2003-12-02 | |||
| JP2016068567A | 2016-05-09 | |||
| JP3189169U | 2014-02-27 | |||
| JP2000211072A | 2000-08-02 | |||
| JP2002285020A | 2002-10-03 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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