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Patent Searching and Data


Title:
HEAT SHRINKABLE LAMINATE FILM, AND MOLDED PRODUCT AND VESSEL USING SAID FILM
Document Type and Number:
WIPO Patent Application WO/2006/051628
Kind Code:
A1
Abstract:
[PROBLEMS] This invention provides a heat shrinkable laminate film, which is excellent in breaking resistance, rigidity, transparency after regeneration and addition, and particularly shrink finishing, and a molded product and a vessel. [MEANS FOR SOLVING PROBLEMS] The heat shrinkable laminate film comprises at least three layers of an intermediate layer and obverse and reverse layers provided on respective both sides of the intermediate layer and has been stretched at least in a monoaxial direction. The intermediate layer comprises a layer composed mainly of at least one polystyrene resin. The obverse and reverse layers are formed of a layer composed mainly of at least one polyester resin and are such that the ratio of the thickness thereof to the thickness of the whole film is not more than 75%. The polystyrene resin is preferably a block copolymer. The heat shrinkable laminate film preferably has a birefringent index (&Dgr n) of not less than 1.0 × 10-3 and not more than 80.0 × 10-3. The molded product and the vessel use the above heat shrinkable laminate film.

Inventors:
HIRUMA TAKASHI (JP)
YAMADA TAKEYOSHI (JP)
TANAKA YUKIHIRO (JP)
TAKAGI JUN (JP)
Application Number:
PCT/JP2005/008063
Publication Date:
May 18, 2006
Filing Date:
April 27, 2005
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
HIRUMA TAKASHI (JP)
YAMADA TAKEYOSHI (JP)
TANAKA YUKIHIRO (JP)
TAKAGI JUN (JP)
International Classes:
B32B27/36; B29C55/02; B29C61/06; B32B27/30; B65D1/09; B65D25/34; B65D65/40; G09F3/04; (IPC1-7): B32B27/36; B29C55/02; B29C61/06; B32B27/30; B65D1/09; B65D25/34; B65D65/40; G09F3/04
Foreign References:
JPS6141543A1986-02-27
JPH07137212A1995-05-30
JPH11105222A1999-04-20
JP2002351332A2002-12-06
Attorney, Agent or Firm:
Oshima, Yumiko (1-20-10-203 Takadanobab, Shinjuku-ku Tokyo 75, JP)
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