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Title:
HEAT-SHRINKABLE LAMINATED FILM, MOLDED ARTICLE USING THE FILM, HEAT-SHRINKABLE LABEL AND CONTAINER
Document Type and Number:
WIPO Patent Application WO/2012/070130
Kind Code:
A1
Abstract:
A heat-shrinkable laminated film suitable for use in shrink packaging, a shrink label and so on, being a heat-shrinkable film which includes a (B) layer that comprises both a polyester resin and a polystyrene resin as the main components between an (A) layer that comprises a polyester resin as the main component and a (C) layer that comprises as the main component either a polystyrene resin or a mixed resin comprising a polyester resin and a polystyrene resin and in which the (B) layer is made of a hard polyester resin or a hard polyester/soft polyester mixture, and a soft styrene resin, a hard styrene resin, or a mixture of both, or alternatively, the content of the polyester resin in the (B) layer is adjusted to a level lower than the content thereof in the (A) layer, while the content of the polyester resin in the (C) layer is adjusted to a level lower than the content thereof in the (B) layer. Thus, the heat-shrinkable laminated film exhibits excellent heat shrink characteristics, transparency, and interlaminar bonding at ordinary temperatures, is less susceptible to delamination even when subjected to high -temperature treatment, and rarely suffers whitening even when bent during the fabrication.

Inventors:
MUTA TAKATOSHI (JP)
NEMOTO TOMOYUKI (JP)
TAKAGI JUN (JP)
HAYASHI KANAKO (JP)
Application Number:
PCT/JP2010/070940
Publication Date:
May 31, 2012
Filing Date:
November 24, 2010
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
MUTA TAKATOSHI (JP)
NEMOTO TOMOYUKI (JP)
TAKAGI JUN (JP)
HAYASHI KANAKO (JP)
International Classes:
B32B27/30; B32B27/00; B32B27/36; B65D23/00; B65D25/36; B65D65/04; B65D65/40
Domestic Patent References:
WO2006051884A12006-05-18
Foreign References:
JP2010241055A2010-10-28
JP2010264657A2010-11-25
Attorney, Agent or Firm:
YAMAMOTO, Noriaki et al. (JP)
Yamamoto 典輝 (JP)
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Claims:



 
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