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Patent Searching and Data


Title:
HEAT-SHRINKABLE LAYERED FILM AND PACKAGE MADE WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/2004/096540
Kind Code:
A1
Abstract:
A heat-shrinkable layered film which comprises a layer comprising a polycarboxylic acid polymer, a layer comprising a polyvalent-metal compound, and a heat-shrinkable substrate film. Specifically, the heat-shrinkable layered film comprises a heat-shrinkable substrate film (base film) and, disposed on at least one side thereof, at least one pair of layer constitutions comprising a layer (a) comprising a polycarboxylic acid polymer (A) and, adjacent thereto, a layer (b) comprising a polyvalent-metal compound (B), and the film has a degree of heat shrinkage of 3 to 90%. Also provided are: a package obtained by packaging an article with the heat-shrinkable layered film; and a heat-shrinkable label.

Inventors:
KASHIMURA MASAYUKI (JP)
OHIRA HIROSHI (JP)
INABA YUSAKU (JP)
TANAKA HIDEAKI (JP)
Application Number:
PCT/JP2004/005995
Publication Date:
November 11, 2004
Filing Date:
April 26, 2004
Export Citation:
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Assignee:
KUREHA CHEMICAL IND CO LTD (JP)
KASHIMURA MASAYUKI (JP)
OHIRA HIROSHI (JP)
INABA YUSAKU (JP)
TANAKA HIDEAKI (JP)
International Classes:
B29C61/00; B32B27/08; (IPC1-7): B32B27/30; C08J7/04
Foreign References:
JP2000000931A2000-01-07
JP2002120848A2002-04-23
JPS591352A1984-01-06
JPS62294547A1987-12-22
JPH0939970A1997-02-10
JP2001310425A2001-11-06
JP2001019782A2001-01-23
Other References:
See also references of EP 1632346A4
None
Attorney, Agent or Firm:
Miura, Yoshikazu (4 Kojimachi 5-chom, Chiyoda-ku Tokyo, JP)
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