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Patent Searching and Data


Title:
HEAT-SHRINKABLE MULTI-LAYER FILM
Document Type and Number:
WIPO Patent Application WO/2017/061308
Kind Code:
A1
Abstract:
The present invention provides a heat-shrinkable multi-layer film that has a low density, excellent shrinking characteristics, high rigidity, and excellent transparency, and in which interlayer peeling is less likely to occur. The present invention is a heat-shrinkable multi-layer film comprising front and back layers and an intermediate layer. The front and back layers include 60-80 wt% of a cyclic olefin-based resin and 20-40 wt% of an ethylene-based resin. The intermediate layer includes 50-80 wt% of an olefin-based resin and 20-50 wt% of a plastic resin. When the total amount of resin components constituting the intermediate layer is defined as 100 mol%, the intermediate layer includes 35-70 mol% of a propylene component, 1-10 mol% of an ethylene component, and 1-10 mol% of a butene component.

Inventors:
OHNO NAOKI (JP)
TANAKA TADAYOSHI (JP)
Application Number:
PCT/JP2016/078481
Publication Date:
April 13, 2017
Filing Date:
September 27, 2016
Export Citation:
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Assignee:
GUNZE KK (JP)
International Classes:
B32B27/32; B65D23/08; G09F3/04
Domestic Patent References:
WO2014080777A12014-05-30
Foreign References:
JP2008174728A2008-07-31
JP2008173962A2008-07-31
JP2006281584A2006-10-19
JP2001341250A2001-12-11
JP2007253349A2007-10-04
JPH091751A1997-01-07
Other References:
See also references of EP 3360681A4
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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