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Title:
HEAT-SHRINKABLE MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2018/135474
Kind Code:
A1
Abstract:
In a heat-shrinkable multilayer film pertaining to the present invention, an inner surface layer that is in contact with contents, an adhesive layer, and an intermediate layer that is adjacent to the adhesive layer are layered in the stated order from inside to outside. The inner surface layer includes an ethylene-vinyl acetate copolymer, the adhesive layer includes an acid-modified ethylene copolymer, and the intermediate layer includes a polyamide-based resin.

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Inventors:
KITADA ICHIRO (JP)
ITOH TADAYOSHI (JP)
NAMBU SHOTA (JP)
Application Number:
PCT/JP2018/000968
Publication Date:
July 26, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
B32B27/32; B32B7/02; B65D65/40; B65D81/24
Domestic Patent References:
WO2009123027A12009-10-08
Foreign References:
JPH0655711A1994-03-01
JPH04216050A1992-08-06
JPS59152853A1984-08-31
JP2016147373A2016-08-18
JPS60189429A1985-09-26
US20080274314A12008-11-06
Other References:
See also references of EP 3572231A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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