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Title:
HEAT SHRINKING APPARATUS FOR SHRINK FILM
Document Type and Number:
WIPO Patent Application WO/2008/072366
Kind Code:
A1
Abstract:
This invention provides a heat shrinking apparatus for a shrink film, which can uniformly heat shrink a shrink film covering a part or the whole of an article and can prevent the adherence of water droplets on the surface of the article and the shrink film. The heat shrinking apparatus comprises a heat treatment chamber (10) installed so as to surround a transfer conveyor (C) for transferring a bottle on which a cylindrical label has been fitted, and heating means for heating the cylindrical label fitted on the bottle passed through the heat treatment chamber (10). The heat treatment chamber (10) comprises an external tunnel (11A) and an internal tunnel (12A) installed in a preheating zone, and an external tunnel (11B) and an internal tunnel (12B) installed in a main heating zone. The heating means comprises preheating means (21) for preliminarily heating and softening the cylindrical label fitted on the bottle passed through the interior of the internal tunnel (12A), and main heating means (22) for heat shrinking the cylindrical label, fitted on the bottle passed through the interior of the internal tunnel (12B), by superheated steam.

Inventors:
UETSUKI, Akira (inc. 1-5, Ishiharacho, Higashi-ku, Sakai-sh, Osaka 02, 5998102, JP)
植月晶 (〒02 大阪府堺市東区石原町1丁5番地株式会社フジアステック内 Osaka, 5998102, JP)
Application Number:
JP2007/001348
Publication Date:
June 19, 2008
Filing Date:
December 05, 2007
Export Citation:
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Assignee:
FUJI SEAL INTERNATIONAL, INC. (3-18, Imazukita 5-chome Tsurumi-ku, Osaka-sh, Osaka 41, 5380041, JP)
株式会社フジシールインターナショナル (〒41 大阪府大阪市鶴見区今津北5丁目3番18号 Osaka, 5380041, JP)
UETSUKI, Akira (inc. 1-5, Ishiharacho, Higashi-ku, Sakai-sh, Osaka 02, 5998102, JP)
International Classes:
B65B53/04
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