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Patent Searching and Data


Title:
HEAT SINK AND CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/082783
Kind Code:
A1
Abstract:
Provided are: a heat sink that suppresses excessive cooling of electronic components that do not require excessive cooling, and with which it is possible to cool, with high efficiency, only electronic components requiring cooling; and a circuit device including the heat sink. A heat sink (100A) comprises piping (10) and a cooling block (11). At least one projection (12) is formed on the cooling block (11). The piping (10) is in contact with the projection (12). The piping (10) is disposed with a space from the portions (13) of the cooling block (11) other than the projection.

Inventors:
HARADA, Keiji (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
MIZUTANI, Shuhei (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
TANIGUCHI, Yoshihiro (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
TAKATA, Masaki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2018/038781
Publication Date:
May 02, 2019
Filing Date:
October 18, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
H05K7/20; F25B1/00; H01L25/07; H01L25/18; H02M7/48; H01L23/473
Foreign References:
US20080035310A12008-02-14
JPH0563385A1993-03-12
JP2004336929A2004-11-25
JP2004056126A2004-02-19
JPS6083255A1985-05-11
JP2003289124A2003-10-10
JP2003121039A2003-04-23
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Festival Tower West, 2-4 Nakanoshima 3-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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