HEAT SINK AND MANUFACTURING METHOD FOR HEAT SINK

WIPO Patent Application WO/2020/059541

A1

The present invention provides a heat sink that has high thermal conductivity in the thickness direction, approximately the linear expansion coefficient of a semiconductor element, and low anisotropy of thermal expansion in the longitudinal direction and the width direction. The present invention also provides a manufacturing method for the heat sink. In the heat sink, a plurality of core materials comprising a low-thermal-expansion material are helically inserted in the longitudinal direction without contacting each other in the thickness direction, the width direction, and the longitudinal direction of a high-thermal-conductivity material. This heat sink can be obtained by a manufacturing method having: a compositing step, in which a plurality of core materials comprising a low-thermal-expansion material are inserted in the longitudinal direction of a wire comprising a high-thermal-conductivity material having a circular cross-section, and a composite wire in which there is no contact between the plurality of core materials in the longitudinal direction and the width direction of the wire is obtained; a twisting step in which twisting is implemented in the longitudinal direction of the composite wire to yield a twisted wire; and a rolling step in which the twisted wire material is rolled into the shape of a plate. In this case, the twist pitch P of the twisted wire is preferably in a range of 1.5 D ≤ P ≤ 5.0 D with respect to the diameter D of the composite wire.

MIYASHITA KATSUMI (JP)
KODAMA KENJI (JP)
TONOGI TATSUYA (JP)

PCT/JP2019/035193

March 26, 2020

September 06, 2019

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HITACHI METALS LTD (JP)

H01L23/373; H05K7/20

US6326685B1	2001-12-04
JPH07249717A	1995-09-26

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