Title:
HEAT SINK MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/096432
Kind Code:
A1
Abstract:
Provided is a heat sink material which has excellent heat dissipation properties and in which molded articles having various shapes and comprising various materials can be utilized as the base of the heat sink material. The heat sink material itself has excellent resistance, can be configured so as to have a reduced thickness, and is especially suitable for use as a heat sink material for semiconductor devices especially for cell phones, personal computers, etc. The heat sink material is equipped with a composite deposit formed by electroplating, the composite deposit comprising a metal deposit as a matrix and diamond particles that have been co-deposited in the matrix so that the amount of the co-deposited particles gradually changes in the thickness direction of the metal deposit.
Inventors:
NAKAGAWA KAZUSHI (JP)
NAKAMURA YOSHIHIRO (JP)
YAMAMOTO SHINYA (JP)
MATSUMURA SOWJUN (JP)
NAKAMURA YOSHIHIRO (JP)
YAMAMOTO SHINYA (JP)
MATSUMURA SOWJUN (JP)
Application Number:
PCT/JP2011/052145
Publication Date:
August 11, 2011
Filing Date:
February 02, 2011
Export Citation:
Assignee:
NIPPON PREC JEWEL INDUSTRY CO LTD (JP)
NAKAGAWA KAZUSHI (JP)
NAKAMURA YOSHIHIRO (JP)
YAMAMOTO SHINYA (JP)
MATSUMURA SOWJUN (JP)
NAKAGAWA KAZUSHI (JP)
NAKAMURA YOSHIHIRO (JP)
YAMAMOTO SHINYA (JP)
MATSUMURA SOWJUN (JP)
International Classes:
C25D15/02; H01L23/373
Foreign References:
| JPH10310893A | 1998-11-24 | |||
| JPH06272093A | 1994-09-27 | |||
| JPH08311696A | 1996-11-26 | |||
| JP2008155362A | 2008-07-10 | |||
| JPH0758256A | 1995-03-03 | |||
| JPH0846070A | 1996-02-16 | |||
| JPH08267644A | 1996-10-15 | |||
| JP2002088171A | 2002-03-27 | |||
| JP2007214224A | 2007-08-23 | |||
| JP2008135532A | 2008-06-12 | |||
| JP2004200347A | 2004-07-15 |
Other References:
See also references of EP 2543750A4
Attorney, Agent or Firm:
NISHIKAWA YUKO (JP)
Yuko Nishikawa (JP)
Yuko Nishikawa (JP)
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Claims: