Title:
HEAT SINK AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/043179
Kind Code:
A1
Abstract:
Provided is a low thermal expansion rate, high thermal conductivity heat sink having a clad structure of Cu-Mo composite material and Cu material. In the heat sink, a Cu-Mo composite layer, a Cu layer, and a Cu-Mo composite layer are stacked in this order in a plate thickness direction, or Cu-Mo composite layers and Cu layers are alternately stacked in the plate thickness direction to form a configuration of three or more Cu-Mo composite layers and two or more Cu layers, wherein the outermost layers on both sides comprise Cu-Mo composite layers. The Cu-Mo composite layers include a plate thickness cross sectional structure in which flat Mo phases are dispersed in a Cu matrix. The clad structure makes it possible to obtain high thermal conductivity with a low thermal expansion rate.
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Inventors:
TERAO HOSHIAKI (JP)
HASHIMOTO KOUICHI (JP)
HASHIMOTO KOUICHI (JP)
Application Number:
PCT/JP2017/029787
Publication Date:
March 08, 2018
Filing Date:
August 21, 2017
Export Citation:
Assignee:
JFE PREC CORPORATION (JP)
International Classes:
H01L23/373; B22F3/10; B22F3/24; B22F3/26; B22F7/06; C22C1/04; C22C27/04; C22F1/18; C22F1/00
Foreign References:
| JP2001358266A | 2001-12-26 | |||
| JP2000323632A | 2000-11-24 | |||
| JP2007115731A | 2007-05-10 | |||
| JP2003037230A | 2003-02-07 | |||
| JP2001358266A | 2001-12-26 | |||
| JPH11307701A | 1999-11-05 |
Other References:
See also references of EP 3509100A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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