Title:
HEAT SINK, METHOD FOR USING HEAT SINK, AND AIR CONDITIONING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/203083
Kind Code:
A1
Abstract:
A heat sink (1) is provided with: a body (3a) having a first surface in which a first groove is provided; a fin (4a) provided on one surface side of the body (3a); a body (3b) which has a second surface adjacent to the first surface and has, formed in the second surface, a second groove extending in the direction in which the first groove extends and facing the first groove; a fin (4b) provided on one surface side of the body (3b); and refrigerant piping (8) provided between the first groove and the second groove.
Inventors:
MURAMATSU MASAKI (JP)
HARADA KEIJI (JP)
TAKATA MASAKI (JP)
HARADA KEIJI (JP)
TAKATA MASAKI (JP)
Application Number:
PCT/JP2019/015570
Publication Date:
October 24, 2019
Filing Date:
April 10, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24F1/24; H01L23/36; H01L23/473; H05K7/20
Domestic Patent References:
WO2019053791A1 | 2019-03-21 |
Foreign References:
JP2018031549A | 2018-03-01 | |||
JP2010040996A | 2010-02-18 | |||
JP2006046694A | 2006-02-16 | |||
JPS5430640A | 1979-03-07 | |||
JP2008076008A | 2008-04-03 | |||
JPH05187724A | 1993-07-27 | |||
JP2010153443A | 2010-07-08 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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