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Title:
HEAT SINK, METHOD FOR USING HEAT SINK, AND AIR CONDITIONING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/203083
Kind Code:
A1
Abstract:
A heat sink (1) is provided with: a body (3a) having a first surface in which a first groove is provided; a fin (4a) provided on one surface side of the body (3a); a body (3b) which has a second surface adjacent to the first surface and has, formed in the second surface, a second groove extending in the direction in which the first groove extends and facing the first groove; a fin (4b) provided on one surface side of the body (3b); and refrigerant piping (8) provided between the first groove and the second groove.

Inventors:
MURAMATSU Masaki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
HARADA Keiji (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
TAKATA Masaki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2019/015570
Publication Date:
October 24, 2019
Filing Date:
April 10, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F24F1/24; H01L23/36; H01L23/473; H05K7/20
Domestic Patent References:
WO2019053791A12019-03-21
Foreign References:
JP2018031549A2018-03-01
JP2010040996A2010-02-18
JP2006046694A2006-02-16
JPS5430640A1979-03-07
JP2008076008A2008-04-03
JPH05187724A1993-07-27
JP2010153443A2010-07-08
Attorney, Agent or Firm:
KIMURA Mitsuru (2nd Floor, Kyohan Building 7, Kandanishiki-cho 2-chome, Chiyoda-k, Tokyo 54, 〒1010054, JP)
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