Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT SINK MODULE AND AN ARRANGEMENT OF HEAT SINK MODULES
Document Type and Number:
WIPO Patent Application WO2001065899
Kind Code:
A3
Abstract:
The invention relates to a plate-like heat sink module (1) having a polygon-shaped horizontal projection. A heat-generating component (2) can be fixed to the upper side of said module. The lower side of said module is provided with cooling ribs (3). The outer edges of said module are provided with surface structures which are complementary in relation to one another. Several similar heat sink modules (1) can be joined together in a plane by means of said structures that are configured in such a way that a heat sink module (1) can be joined to another heat sink module (1) in one orientation only. The invention also relates to an arrangement of heat sink modules. A heat sink being used for interconnecting several condensers to form a condenser bank can be produced in a particularly flexible manner by means of the inventive arrangement of heat sink modules.

Inventors:
HEBEL RAINER (DE)
MICHEL HARTMUT (DE)
Application Number:
DE0100557W
Publication Date:
December 06, 2001
Filing Date:
February 14, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EPCOS AG
HEBEL, RAINER
MICHEL, HARTMUT
International Classes:
F28F3/02; F28F7/00; H01G2/08; H05K7/20; (IPC1-7): H05K7/20; H01G2/08
Foreign References:
DE3929701A11991-03-14
Other References:
PATENT ABSTRACTS OF JAPAN vol. 018, no. 049 (E - 1497) 26 January 1994 (1994-01-26)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31)
Download PDF: