Title:
HEAT SINK PLATE
Document Type and Number:
WIPO Patent Application WO/2020/184772
Kind Code:
A1
Abstract:
The present invention relates to a heat sink plate that allows good bonding to be maintained in a process of bonding with devices which generate a large amount of heat, such as high-power electronic devices or optical elements, and include a ceramic material, in a packaging process, and in a process of use. The heat sink plate according to the present invention comprises: a first layer formed of copper (Cu) or a Cu alloy; a second layer which is provided on the first layer and formed of an alloy including Cu and molybdenum (Mo); a third layer which is provided on the second layer and formed of Cu or a Cu alloy; a fourth layer which is provided on the third layer and formed of an alloy including Cu and Mo; and a fifth layer which is provided on the fourth layer and formed of Cu or a Cu alloy, wherein the thicknesses of the first layer, the third layer, and the fifth layer are 10-1,000 µm, the thicknesses of the second layer and the fourth layer are 10-60 µm, and the content of Mo included in the entire heat sink plate is 3-15 wt%.
Inventors:
CHO MEOUNG-WHAN (KR)
KIM IL-HO (KR)
LEE SEOG-WOO (KR)
KIM YOUNG-SUK (KR)
KIM IL-HO (KR)
LEE SEOG-WOO (KR)
KIM YOUNG-SUK (KR)
Application Number:
PCT/KR2019/003852
Publication Date:
September 17, 2020
Filing Date:
April 02, 2019
Export Citation:
Assignee:
THE GOODSYSTEM CORP (KR)
International Classes:
H01L23/373; H01L23/367
Foreign References:
| KR20180097021A | 2018-08-30 | |||
| KR20080063327A | 2008-07-03 | |||
| KR20150133312A | 2015-11-30 | |||
| JP2019029631A | 2019-02-21 | |||
| JP2013077666A | 2013-04-25 |
Attorney, Agent or Firm:
IAM PATENT FIRM (KR)
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