Title:
HEAT SINK STRUCTURE FOR A HOUSING OF A WIRELESS COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/002116
Kind Code:
A1
Abstract:
The present invention relates to a heat sink structure for a housing of a wireless communication apparatus, wherein the structure comprises a heat sink plate comprising: a plurality of heat sink fins; a mounting structure coupled and fixed to an installation post on which the entire housing is installed to mount the entire housing; and a contacting structure for contacting a portion of an exterior surface of the installation post when installed on the installation post by means of the mounting structure.
Inventors:
KIM DUK-YONG (KR)
Application Number:
PCT/KR2009/003569
Publication Date:
January 06, 2011
Filing Date:
June 30, 2009
Export Citation:
Assignee:
KMW INC (KR)
KIM DUK-YONG (KR)
KIM DUK-YONG (KR)
International Classes:
H04B1/03; H04Q1/02
Domestic Patent References:
| WO2004105261A1 | 2004-12-02 |
Foreign References:
| US20080239632A1 | 2008-10-02 | |||
| KR200419966Y1 | 2006-06-26 | |||
| KR20090119206A | 2009-11-19 |
Attorney, Agent or Firm:
LEE, Keon-Joo (KR)
이건주 (KR)
이건주 (KR)
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