HEAT SINK - WELCON INC

Title:

HEAT SINK

Document Type and Number:

WIPO Patent Application WO/2019/043801

Kind Code:

A1

Abstract:

The purpose of the present invention is to improve the cooling capability of a heat sink. A heat sink 10 is a cooler of layered construction in which a refrigerant is channeled from an inflow port 14a to an outflow port 14b, thereby cooling a heat-radiating body 16 with which contact is made, wherein a heat receiving plate 18, a flow channel plate 20, an orifice plate 22, a header plate 24, and a back surface plate 26 are diffusion-bonded in order from the surface side. The flow channel plate 20 comprises a plurality of narrow cooling passages 28 placed vertically and horizontally. The orifice plate 22 comprises: an ejection hole 30 for ejecting refrigerant to the narrow cooling passages 28, and an exhaust hole 32 for exhausting refrigerant from the narrow cooling passages 28. The header plate 24 comprises a partition plate 36 that partitions the inflow port 14a and the outflow port 14b. The partition plate 36 has: a plurality of parallel plates 38; and a first end plate 40 and a second end plate 42 for alternately blocking one opening and the other opening of the parallel plate 38. An inflow path 44 that guides the refrigerant from the inflow port 14a to the ejection hole 30, and an outflow path 46 that guides the refrigerant from the exhaust hole 32 to the outflow port 14b are formed by the partition plate 36 and a peripheral wall 34.

Inventors:

SUZUKI YUTAKA (JP)
SAITO TAKASHI (JP)
IKARASHI SHINGO (JP)

Application Number:

PCT/JP2017/031029

Publication Date:

March 07, 2019

Filing Date:

August 29, 2017

Export Citation:

Click for automatic bibliography generation Help

Assignee:

WELCON INC (JP)

International Classes:

H01L23/473; H05K7/20

Domestic Patent References:

WO2014014054A1

2014-01-23

Foreign References:

JP2007142390A	2007-06-07
JP2004047809A	2004-02-12
JPS5957499A	1984-04-03
JP2014096527A	2014-05-22
JP2014096527A	2014-05-22

Other References: