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Title:
HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2024/024763
Kind Code:
A1
Abstract:
Provided is a heat sink with which it is possible to reduce pressure loss occurring when cooling air flows along a heat-dissipating fin while ensuring exceptional heat exchange performance in the heat-dissipating fin. A heat sink having: a heat-receiving part that is thermally connected to a heat-generating body; a flat first heat-dissipating fin that is thermally connected to the heat-receiving part, the first heat-dissipating fin having a first main surface; and a flat second heat-dissipating fin that is thermally connected to the heat-receiving part, the second heat-dissipating fin having a second main surface, and the area of the second main surface being less than the area of the first main surface. The second heat-dissipating fin is disposed between a plurality of the first heat-dissipating fins, specifically at a position such that the second main surface overlaps the first main surface in plan view.

Inventors:
HIKICHI SHUTA (JP)
SAKAI HIROSHI (JP)
MEGURO MASAHIRO (JP)
KAWABATA KENYA (JP)
Application Number:
PCT/JP2023/027108
Publication Date:
February 01, 2024
Filing Date:
July 25, 2023
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
F28D15/02; H01L23/427; H05K7/20
Foreign References:
JP2022060088A2022-04-14
JP2000161880A2000-06-16
JP2001345408A2001-12-14
CN201476670U2010-05-19
US20130014918A12013-01-17
JP2003142637A2003-05-16
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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