Title:
HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2024/048484
Kind Code:
A1
Abstract:
The present invention relates to a heat sink (1) comprising a base section (20) including a first surface (21) and a second surface (22) opposing to the first surface (21) and to which heating elements (100) are thermally connected, and radiating fins (10) erected on the first surface (21) of the base section (20), the base section (20) and the radiating fins (10) being integrally formed, wherein a part of a heat conduction member is embedded in the heat sink (1).
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Inventors:
INAGAKI YOSHIKATSU (JP)
UCHIMURA YASUHIRO (JP)
OKADA HIROSHI (JP)
UCHIMURA YASUHIRO (JP)
OKADA HIROSHI (JP)
Application Number:
PCT/JP2023/030863
Publication Date:
March 07, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L23/36; F28D15/02; H01L23/427; H05K7/20
Foreign References:
| JP2000018852A | 2000-01-18 | |||
| JPH10253273A | 1998-09-25 | |||
| CN210298345U | 2020-04-10 | |||
| JP2000269676A | 2000-09-29 | |||
| JPH04335949A | 1992-11-24 | |||
| US20090101308A1 | 2009-04-23 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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