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Patent Searching and Data


Title:
HEAT SOURCE UNIT
Document Type and Number:
WIPO Patent Application WO/2018/061426
Kind Code:
A1
Abstract:
A bottom frame (50) for forming the bottom surface of a casing (40) is divided into a primary bottom frame (51) on which a first compressor (11) is provided, and a secondary bottom frame (55) on which a second compressor (21) is provided. The primary bottom frame (51) is further divided into a first bottom frame (52) and a second bottom frame (53). The first compressor (11) is provided on the first bottom frame (52), and a refrigerant circuit-forming component (47) which is changed or added according to capacity or function is provided on the second bottom frame (53).

Inventors:
KOIKE FUMIAKI (JP)
KAMITANI SHIGEKI (JP)
HORITA TAKUYA (JP)
HIRAWA DAIKI (JP)
TANAKA YUUSUKE (JP)
KOSHIJI TAICHI (JP)
Application Number:
PCT/JP2017/026613
Publication Date:
April 05, 2018
Filing Date:
July 24, 2017
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
F24F1/56; F24F1/10; F24F1/16; F24F1/50; F24F13/20
Foreign References:
JP2007093151A2007-04-12
US20150338141A12015-11-26
JP2011158137A2011-08-18
JP2007071517A2007-03-22
JP2011158137A2011-08-18
Other References:
See also references of EP 3514457A4
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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