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Patent Searching and Data


Title:
HEAT-STORAGE MATERIAL, COMPOSITION THEREFOR, AND USES OF THESE
Document Type and Number:
WIPO Patent Application WO/2004/007631
Kind Code:
A1
Abstract:
A heat-storage material which is a polymer or oligomer comprising as the main component a unit comprising a polyether main chain and side chains which can crystallize each other; and a heat-storage composition which is obtained by incorporating the heat-storage material into a synthetic resin. When the ambient temperature increases, this heat-storage material absorbs heat and melts. When the ambient temperature decreases, the material emits heat and solidifies. The material hence mitigates fluctuations in ambient temperature and is apt to make the ambient temperature constant. It thus functions as a heat-storage material. From the heat-storage material and heat-storage composition can be produced a film or sheet, layered product, molded article, heat-storage composite fiber, and heat-storage fabric member which are suitable for applications in which they are used around the human body while being in contact or not in contact therewith.

Inventors:
ABE KAZUAKI (JP)
SANO MASAHIRO (JP)
Application Number:
PCT/JP2003/008265
Publication Date:
January 22, 2004
Filing Date:
June 30, 2003
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
IDEMITSU TECHNOFINE CO LTD (JP)
ABE KAZUAKI (JP)
SANO MASAHIRO (JP)
International Classes:
C08G65/08; C08G65/332; C08G65/48; C09K5/02; C09K5/06; D01F8/04; (IPC1-7): C09K5/00; B32B27/00; C08G65/332; C08L101/00; D01F8/04; F28F21/06
Foreign References:
JPH08165417A1996-06-25
EP0412021A11991-02-06
JPH05256549A1993-10-05
EP0758641A11997-02-19
Attorney, Agent or Firm:
Watanabe, Kihei (26 Kanda Suda-cho 1-chom, Chiyoda-ku Tokyo, JP)
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