Title:
HEAT STORING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/133380
Kind Code:
A1
Abstract:
Provided is a heat storing device that uses a heat storing material and a honeycomb body, wherein the heat storing device is less likely to experience deterioration of the latent heat storing material and damage to the honeycomb body by suppressing rapid increase in the temperature of the latent heat storing material after melting. A heat storing device (10A) comprises a flow channel pipe (21) in which a heating medium can flow, a container (20) that covers an exterior surface (212) of the flow channel pipe (21) and has an interior space (201), and a heat storing body (30) that is accommodated in the interior space (201) and abuts the exterior surface (212) of the flow channel pipe (21). The heat storing body (30) comprises a latent heat storing material (31) and honeycomb bodies (32) that are immersed in the latent heat storing material (31) and in which linear communicating paths (322) are densely arranged in parallel, and the honeycomb bodies (32) are arranged by being aligned in the vertical direction so that the communicating directions of the communicating paths (322) are mutually parallel. Therefore, because a plurality of honeycomb bodies (32) are immersed in the latent heat storing material (31), the communicating paths (322) of the honeycomb bodies (32) are finely divided and immersed in the latent heat storing material (31). Thus, when heated by the heating medium flowing in the flow channel pipe (21), the latent heat storing material (31) inside each communicating path (322) melts at approximately the same time, so the temperature of the latent heat storing material (31) is less likely to increase rapidly after melting and the deterioration of the latent heat storing material (31) and damage to the honeycomb body (32) can be prevented.
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Inventors:
KIRIKI HIROAKI (JP)
Application Number:
PCT/JP2015/055734
Publication Date:
September 11, 2015
Filing Date:
February 27, 2015
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
International Classes:
F28D20/00; C04B38/00; F28D20/02; F28F21/04
Foreign References:
| JP2001012804A | 2001-01-19 | |||
| JPS61261388A | 1986-11-19 | |||
| JP2010169382A | 2010-08-05 | |||
| JPH072739U | 1995-01-17 | |||
| US20080093577A1 | 2008-04-24 | |||
| JPS6162760A | 1986-03-31 | |||
| JP2013228189A | 2013-11-07 | |||
| JP2003502614A | 2003-01-21 | |||
| JPH05306389A | 1993-11-19 | |||
| JPH0297895A | 1990-04-10 |
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