HEAT SUNK, LASER MODULE, LASER DEVICE, AND LASER-PROCESSING DEVICE

Title:

HEAT SUNK, LASER MODULE, LASER DEVICE, AND LASER-PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2004/076952

Kind Code:

A1

Abstract:

A heat sink has a pair of openings as a lead-in and a discharge opening for a cooling medium, and from one opening to the other is formed a cooling medium flow passage in a left-right symmetrical manner as seen from the top. In an area aligned with an area thermally connected to a heat-generating body in the cooling medium flow passage, there are formed projections with a shape the cross section of which is reduced from the bottom face upward or reduced from the upper face downward. The heat sink is assembled by joining a heat radiating plate where the projections are formed and other tabular heat-radiating plate. A heat sink that has excellent thermal efficiency and reliability and is of low cost, and a laser module, a laser device, and a laser-processing device that use the heat sink are obtained.

Inventors:

KOUTA HIKARU (JP)
TAKAHASHI HISAYA (JP)
MIKUBO KAZUYUKI (JP)
ONO HIDEYUKI (JP)
TUNEKANE MASAKI (JP)
ISHIDA TOSHINORI (JP)
KUBOTA KEIICHI (JP)

Application Number:

PCT/JP2004/001782

Publication Date:

September 10, 2004

Filing Date:

February 18, 2004

Export Citation:

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Assignee:

LASERFRONT TECHNOLOGIES INC (JP)
KOUTA HIKARU (JP)
TAKAHASHI HISAYA (JP)
MIKUBO KAZUYUKI (JP)
ONO HIDEYUKI (JP)
TUNEKANE MASAKI (JP)
ISHIDA TOSHINORI (JP)
KUBOTA KEIICHI (JP)

International Classes:

F28D15/02; H01L23/473; (IPC1-7): F28D15/02; H01S3/094; H01S5/024; H01L23/46

Foreign References:

JP2003047258A	2003-02-14
JPH1070222A	1998-03-10
JPH10209531A	1998-08-07
JP2001257492A	2001-09-21
JPH10111089A	1998-04-28
JP2003008273A	2003-01-10

Other References: