Title:
HEAT TRANSFER DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/101384
Kind Code:
A1
Abstract:
A heat transfer device reducing the surface temperature of chip and manufacturing method thereof. The device comprises an airtight container (1) with vacuum inside, and a metal net (2) covering the inside surface of the airtight container (1), and a metal sheet (3) with vent hole (31) wrapped by metal net (2), and shores (32) fixed on the two surfaces of metal sheet (3), and a liquid working substance filled in the airtight container (1). The manufacturing method comprises the step of forming the shores (32) and the vent hole (31) simultaneously by pressing metal sheet.
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Inventors:
CHIN CHI-TE (CN)
LU SHUSHEN (CN)
LU SHUSHEN (CN)
Application Number:
PCT/CN2008/000205
Publication Date:
August 28, 2008
Filing Date:
January 29, 2008
Export Citation:
Assignee:
ACMECOOLS ELECTRONIC TECHNOLOG (CN)
CHIN CHI-TE (CN)
LU SHUSHEN (CN)
CHIN CHI-TE (CN)
LU SHUSHEN (CN)
International Classes:
H05K7/20; B21D53/04; F28D15/02; H01L23/427
Foreign References:
| CN2608928Y | 2004-03-31 | |||
| CN1629592A | 2005-06-22 | |||
| CN2765440Y | 2006-03-15 | |||
| CN1784137A | 2006-06-07 | |||
| US6889756B1 | 2005-05-10 | |||
| CN1895011A | 2007-01-10 | |||
| JP2002299528A | 2002-10-11 | |||
| CN2704925Y | 2005-06-15 |
Attorney, Agent or Firm:
GUANGZHOU YUEGAO PATENT AGENT LIMITED CORPORATION (10/F Block D Bihaiwang,N0. 37 Linjing Road,The Pearlriver New City CBD,Guangzhou, Guangdong 3, CN)
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