Title:
HEAT TRANSFER PANEL
Document Type and Number:
WIPO Patent Application WO/2019/159379
Kind Code:
A1
Abstract:
A floor heating panel (10) as a heat transfer panel has: a panel plate body (11); an upper side metal plate (12) fixed to the front surface of the panel plate body (11) and a lower side metal plate (13) fixed to the rear surface thereof; and a metal member (14) that is interposed between the upper side and lower side metal plates and penetrates, and attaches to, the panel plate body (11), wherein heat is transferred between the lower side metal plate (13) and the upper side metal plate (12).
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Inventors:
CHO BYUNGCHUL (JP)
Application Number:
PCT/JP2018/009270
Publication Date:
August 22, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
CHO BYUNGCHUL (JP)
International Classes:
F24D3/16
Foreign References:
| JP2006183985A | 2006-07-13 | |||
| JP2000111070A | 2000-04-18 | |||
| JP2005127548A | 2005-05-19 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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