Title:
HEAT TRANSFER PANEL
Document Type and Number:
WIPO Patent Application WO/2019/221275
Kind Code:
A1
Abstract:
According to the present invention, a floor heating panel (10) as a heat transfer panel has: a panel plate body (11); an upper metallic plate (12) fixed to the front surface of the panel plate body (11) and a lower metallic plate (13) fixed to the rear surface of the panel plate body (11); and a metallic member (14) which is sandwiched between the upper and lower metallic plates and mounted in a through-hole (17) that passes through the panel plate body (11) and which is formed of a bulk metallic material corresponding to a predetermined length in the plate thickness direction of the panel plate body (11), wherein heat is transferred between the lower metallic plate (13) and the upper metallic plate (12).
Inventors:
CHO BYUNGCHUL (JP)
Application Number:
PCT/JP2019/019685
Publication Date:
November 21, 2019
Filing Date:
May 17, 2019
Export Citation:
Assignee:
CHO BYUNGCHUL (JP)
International Classes:
F24D19/00; E04F15/02; E04F15/18; F24D3/16
Foreign References:
| JPH08260683A | 1996-10-08 | |||
| JPH074006A | 1995-01-10 | |||
| JP2006183985A | 2006-07-13 | |||
| JP6352569B1 | 2018-07-04 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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