Title:
HEAT TRANSFER SHEET
Document Type and Number:
WIPO Patent Application WO/2017/170891
Kind Code:
A1
Abstract:
[Problem] To provide a heat transfer sheet which has a high level of adherence between a transfer layer and a substrate, even when inside of a compact printer that becomes heated by the heat of a thermal head, and the transfer layer of which exhibits a high degree of detachibility at the time of transfer. [Solution] The heat transfer sheet of the present invention comprises at least a substrate and a transfer layer, the transfer layer comprising at least a protective layer that is provided so as to be detachable from the substrate, the detaching force of the transfer layer when not heated being at least 1 N/m, and the detaching force of the transfer layer when heated being no more than 10 N/m.
Inventors:
AKIYAMA YUSAKU (JP)
ENOKIDA KAZUKI (JP)
ENOKIDA KAZUKI (JP)
Application Number:
PCT/JP2017/013309
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B41M5/382; B32B7/06
Domestic Patent References:
| WO2015129721A1 | 2015-09-03 |
Foreign References:
| JP2009083137A | 2009-04-23 | |||
| JP2003025736A | 2003-01-29 | |||
| JP2013082210A | 2013-05-09 | |||
| JP2006095982A | 2006-04-13 |
Other References:
See also references of EP 3335898A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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