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Title:
HEAT TRANSFER UNIT FOR COOLING AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/088669
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a structure of a heat transfer unit for cooling capable of achieving a high cooling effect. Thermal diffusion frames (2) for flowing of refrigerant vapor are connected to and extended upward from both ends or near both ends of a thermal diffusion frame (1) for housing refrigerant which is subjected to thermal transfer from a heating element (6), or are connected to and extended upward from said both ends or near both ends and the intermediate position. A predetermined number or more of thermally cooling fins (3) are extended upward from a region, of the thermal diffusion frame (1) for housing refrigerant, that is sandwiched by the thermal diffusion frames (2) for flowing of refrigerant vapor positioned on both ends, and the thermally cooling fins (3) are extended horizontally from a region, of the thermal diffusion frames (2) for flowing of refrigerant vapor positioned on both ends forming the sandwiched region, that has a distance, from the lower end, equal to or smaller than the inner width of the thermal diffusion frames (2) for flowing of refrigerant vapor at both ends, so as to be connected individually or collectively to the thermally cooling fins (3) extended upward, whereby the heat transfer unit for cooling can address the problem.

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Inventors:
OSAWA KENJI (JP)
Application Number:
PCT/JP2015/083360
Publication Date:
June 09, 2016
Filing Date:
November 27, 2015
Export Citation:
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Assignee:
OSAWA KENJI (JP)
International Classes:
F28D15/02; H01L23/427; H05K7/20
Foreign References:
JP2001223308A2001-08-17
JP2007317876A2007-12-06
US20070151706A12007-07-05
JP2005249226A2005-09-15
JP2001144236A2001-05-25
JP2003083688A2003-03-19
Attorney, Agent or Firm:
AKAO, Naoto (JP)
Naoto Akao (JP)
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