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Patent Searching and Data


Title:
HEAT TRANSPORT MEDIUM AND HEAT TRANSPORT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/162544
Kind Code:
A1
Abstract:
This heat transport medium is for use in a heat transport system provided with a refrigeration cycle device (10) in which a refrigerant circulates and a heat transport medium circuit (30) having electrical devices (33-35) provided thereto. The heat transport medium circulates through a heat transport medium passage, performs heat exchange with the refrigerant and is cooled, and absorbs heat from the electrical devices. The heat transport medium is an anhydrous liquid containing no water and comprises a material having a lower polarity than water. As a result, it is possible to ensure low viscosity in the heat transport medium at low temperatures. In addition, by using an anhydrous liquid containing no water as a heat transport medium, it is possible to minimize increases in the conductivity of the heat transport medium resulting from use.

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Inventors:
FUSE TAKUYA (JP)
INAGAKI KOUJI (JP)
NAKAMURA KENJI (JP)
YAMADA TERU (JP)
SUZUKI KAZUMI (JP)
Application Number:
PCT/JP2020/004571
Publication Date:
August 13, 2020
Filing Date:
February 06, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
TANIKAWA YUKA KOGYO CO LTD (JP)
International Classes:
F25B29/00; C09K5/10; F25B1/00; H05K7/20
Foreign References:
JPS60253762A1985-12-14
JP2007524737A2007-08-30
JP2011527726A2011-11-04
JP2007262302A2007-10-11
JP2005203148A2005-07-28
US20050098880A12005-05-12
JP2001010595A2001-01-16
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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