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Title:
HEAT-TREATED WHEAT FLOUR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/095231
Kind Code:
A1
Abstract:
The present invention is a heat-treated wheat flour manufacturing method wherein: 100 parts by mass wheat flour having 25% or less amylose content, and 30-45 parts by mass water having a temperature of 70°C or greater are mixed and a mixture is obtained; and the mixture is heated for 3-60 seconds at an ambient temperature of 100°C or more and less than 120°C, and heat-treated wheat flour having a degree of gelatinization of 50-95% is obtained. Preferably, the mixture of wheat flour and water of the stated temperature is made hotter than 100°C, and not hotter than 110°C, by the heat treatment. Preferably, as the heat-treated wheat flour, heat-treated wheat flour for bakery products or for noodles is manufactured.

Inventors:
YOSHIDA MASASHI (JP)
NAKAMURA KENJI (JP)
WADA MASAYUKI (JP)
AKAISHI TOMOHISA (JP)
NINOMIYA TAKASHI (JP)
ANDO MANAMI (JP)
KONISHI SHOHEI (JP)
ITO KOICHI (JP)
YAGISHITA TAKAHIRO (JP)
Application Number:
PCT/JP2021/043123
Publication Date:
June 01, 2023
Filing Date:
November 25, 2021
Export Citation:
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Assignee:
NISSHIN SEIFUN WELNA INC (JP)
NISSHIN SEIFUN PREMIX INC (JP)
International Classes:
A21D6/00; A23L7/10; A23L7/109
Domestic Patent References:
WO2021095827A12021-05-20
WO2016121570A12016-08-04
Foreign References:
JP2019088255A2019-06-13
JP2017035074A2017-02-16
JP2019126313A2019-08-01
JP2007097507A2007-04-19
JP2003333991A2003-11-25
JP2000262205A2000-09-26
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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