HEAT TREATING APPARATUS AND HEAT TREATING METHOD

WIPO Patent Application WO/2004/090951

A1

A heat treating apparatus for baking a treated substrate having a resist film containing volatile substances, comprising a hot plate (2), a hot plate temperature control part (3), casings (1a, 5, 32) defining a heating space (30) and a flow space (31), air blow parts (18, 18A) and suction parts (10, 10A) forming horizontally flowing air flow in the flow space (31), and controllers (22, 22A) controlling the hot plate temperature control part (3), air blow parts (18, 18A), suction parts (10, 10A), and a gas temperature control part (19) so that, where a hot plate temperature is TP, upper surface temperature of the treated substrate is TS, temperature in the heating space is TH, and temperature in the flow space is TF, the requirement of TF < TH ≤ TS ≤ TP can be satisfied.

YOSHIHARA KOUSUKE (JP)
TERASHITA YUICHI (JP)
SHIZUKUISHI MOMOKO (JP)
OOKOUCHI ATSUSHI (JP)
KYOUDA HIDEHARU (JP)

PCT/JP2004/004359

October 21, 2004

March 26, 2004

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TOKYO ELECTRON LTD (JP)
YOSHIHARA KOUSUKE (JP)
TERASHITA YUICHI (JP)
SHIZUKUISHI MOMOKO (JP)
OOKOUCHI ATSUSHI (JP)
KYOUDA HIDEHARU (JP)

G03F7/30; F27D7/06; F27D19/00; G03F7/16; G03F7/38; H01L21/00; H01L21/027; (IPC1-7): H01L21/027; F27D7/06; F27D19/00; G03F7/30; G03F7/38

JP2002359175A	2002-12-13
JP2002289513A	2002-10-04
JP2002008967A	2002-01-11
JPH0684782A	1994-03-25
JPH11204417A	1999-07-30
JPS6189632A	1986-05-07
JPH11204391A	1999-07-30

Suzuye, Takehiko c/o Suzuye & Suzuye (7-2 Kasumigaseki 3-chom, Chiyoda-ku Tokyo 13, JP)

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