Title:
HEAT-TREATING BOAT FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/1997/032339
Kind Code:
A1
Abstract:
A heat-treating boat (20) for semiconductor wafer (W) is provided with a roof (21), a bottom plate (22), six supports (23-38), and 63 ring-like trays (31). The trays (31) are attached to the grooves (20a) of the supports (23-28). In order to fix the trays (31), a fixing bar (33) is detachably attached to the plates (21 and 22). Therefore, through holes (21a) and recessed sections (22a) are formed in the roof (21) and bottom plate (22) for attaching the fixing bar (33) and notches (34) engaged with the bar (33) are formed in the trays (31). In addition, a notch (32) engaged with the bar (33) is also formed in the support (23). Moreover, projections (41) which come into contact with the side face of the support (24) are provided on the trays (31).
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Inventors:
SHIMAZU TOMOHISA (JP)
NAKAO KEN (JP)
NAKAO KEN (JP)
Application Number:
PCT/JP1997/000526
Publication Date:
September 04, 1997
Filing Date:
February 25, 1997
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SHIMAZU TOMOHISA (JP)
NAKAO KEN (JP)
SHIMAZU TOMOHISA (JP)
NAKAO KEN (JP)
International Classes:
H01L21/67; H01L21/673; (IPC1-7): H01L21/205; H01L21/22; H01L21/31
Foreign References:
| JPH0745691A | 1995-02-14 | |||
| JPS5878423A | 1983-05-12 | |||
| JPH06168902A | 1994-06-14 | |||
| JPS60213022A | 1985-10-25 | |||
| JPH0217633A | 1990-01-22 | |||
| JPH0415229U | 1992-02-06 | |||
| JPH08107081A | 1996-04-23 | |||
| JPH08130192A | 1996-05-21 |
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