Title:
HEAT TREATING DEVICE AND HEAT TREATING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/016421
Kind Code:
A1
Abstract:
A heat treating device is provided with a closed container (1), a processing space (20) provided in the closed container (1) and capable of containing a substrate (5), heaters (21, 22) arranged in the closed container (1) so as to face the processing space (20), and a shower head (10) provided inside the closed container (1) and having a gas introducing hole (15) and gas ejecting holes (31), the gas introducing hole (15) being adapted such that gas inactive to the substrate (5) and heating and cooling the substrate (5) is introduced into the gas introducing hole (15), the gas ejecting holes (31) being arranged facing the substrate (5) and ejecting the gas, which is introduced into the shower head (10) through the gas introducing hole (15), toward the substrate (5). A dispersing plate (17) is provided in the shower head (10), and the dispersing plate (17) partitions the inside of the shower head (10) into an upstream chamber (13) on the gas introducing hole (15) side and a downstream chamber (14) on the gas ejecting hole (31) side. The dispersing plate (17) has formed therein through-holes (32) for interconnecting the upstream chamber (13) and the downstream chamber (14).
Inventors:
TAKAHASHI, Kiyoshi (5-1 Kasama 2-chome, Sakae-ku, Yokohama-sh, Kanagawa 10, 〒2478610, JP)
Application Number:
JP2009/063555
Publication Date:
February 11, 2010
Filing Date:
July 30, 2009
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORPORATION (5-1 Kasama 2-chome, Sakae-ku Yokohama-sh, Kanagawa 10, 〒2478610, JP)
芝浦メカトロニクス株式会社 (〒10 神奈川県横浜市栄区笠間二丁目５番１号 Kanagawa, 〒2478610, JP)
芝浦メカトロニクス株式会社 (〒10 神奈川県横浜市栄区笠間二丁目５番１号 Kanagawa, 〒2478610, JP)
International Classes:
F27D7/02; F27B17/00; F27D7/06; F27D9/00; F27D11/02; C03B32/00
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (Kannai ST Bldg, 4-1 Onoe-cho 1-chome, Naka-ku, Yokohama-sh, Kanagawa 15, 〒2310015, JP)