Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT TREATING FURNACE
Document Type and Number:
WIPO Patent Application WO/2007/108417
Kind Code:
A1
Abstract:
A heat treating furnace that in the process of manufacturing, for example, a ceramic electronic component, at the stage of firing of a ceramic molding, allows continuously performing of binder removal and subsequent firing without needing any complex means and without inviting any equipment magnification or any cost increase. Between heat insulating member (2) installed so as to surround heat treating region (1) within case (3) and the inside wall of the case (3), there is disposed reflector (4) for reflecting of any heat conducted through the heat insulating member (2) from the heat treating region (1). Module heater (8) embedded with heater (7) is used inside the heat insulating member (2). As the reflector (4), use is made of one with the structure such that multiple thin plates (5) are arranged with the major surfaces thereof disposed in parallel with a given spacing therebetween.

Inventors:
OHARA TAKASHI (JP)
Application Number:
JP2007/055410
Publication Date:
September 27, 2007
Filing Date:
March 16, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
OHARA TAKASHI (JP)
International Classes:
F27B17/00; B22F3/10; F27D1/00
Foreign References:
JPS62167096U1987-10-23
JPH10318681A1998-12-04
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi (Daido Seimei Minami-kan 1-2-11 Edobori, Nishi-k, Osaka-shi Osaka 02, JP)
Download PDF: