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Title:
HEAT TREATING SYSTEM AND HEAT TREATING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/040632
Kind Code:
A1
Abstract:
A heat treating system comprising a holding unit for holding a plurality of substrates, a reaction container into which the holding unit is carried, a treating gas supply mechanism for supplying a treating gas into the reaction container, and a heating mechanism for heating the reaction container when the treating gas is supplied to perform a film-forming processing on the substrates. Flow-rate parameter table data in which data on the number of substrates scheduled for treating in one batch is allowed to correspond to the target value data of the treating gas flow-rate parameters is stored in a flow-rate parameter table data storing unit. A control means obtains the target value data of the treating gas flow-rate parameters according to an actual number of substrates scheduled for treating in one batch and based on flow-rate parameter table data stored in the flow-rate parameter table data storing unit, and controls the treating gas supply mechanism according to the target value data. The target value data of the flow-rate parameters is so determined as to provide a uniform film-forming speed to treating batches in which the number of substrate scheduled for treating differs from one another.

Inventors:
FUJITA TAKEHIKO (JP)
OKADA MITSUHIRO (JP)
UMEZAWA KOTA (JP)
HASEBE KAZUHIDE (JP)
SAKAMOTO KOICHI (JP)
Application Number:
PCT/JP2003/013849
Publication Date:
May 13, 2004
Filing Date:
October 29, 2003
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
FUJITA TAKEHIKO (JP)
OKADA MITSUHIRO (JP)
UMEZAWA KOTA (JP)
HASEBE KAZUHIDE (JP)
SAKAMOTO KOICHI (JP)
International Classes:
C23C16/46; C23C16/52; F27B17/00; H01L21/00; H01L21/205; (IPC1-7): H01L21/205; C23C16/52
Foreign References:
JP2001144019A2001-05-25
US6306764B12001-10-23
JP2002270579A2002-09-20
JP2003077782A2003-03-14
Other References:
See also references of EP 1557873A4
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
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