Title:
HEAT TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/026815
Kind Code:
A1
Abstract:
Provided is a heat treatment apparatus which, when simultaneously heating substrates placed on a plurality of susceptors, is capable of controlling the uniformity of temperature within each substrate. The heat treatment apparatus is provided with: a reaction tube (104) which performs predetermined treatment to a plurality of wafers; a plurality of susceptors (112) each of which has a placing surface for placing the wafer and is composed of a conductive material; a rotatable quartz boat (110) wherein the susceptors are arranged by being spaced apart in a direction vertical to the placing surfaces and are supported in the reaction tube; a magnetic field forming section, which is arranged on a side wall of the treatment chamber and is composed of a pair of electromagnets (120, 130) which form an alternating current magnetic field in a direction parallel to the placing surfaces of the susceptors and inductively heat the susceptors; and a control section (200), which controls an alternating current magnetic field formed by the magnetic field forming section.
Inventors:
YONENAGA TOMIHIRO (JP)
KAWANO YUMIKO (JP)
KAWANO YUMIKO (JP)
Application Number:
PCT/JP2009/060527
Publication Date:
March 11, 2010
Filing Date:
June 09, 2009
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
YONENAGA TOMIHIRO (JP)
KAWANO YUMIKO (JP)
YONENAGA TOMIHIRO (JP)
KAWANO YUMIKO (JP)
International Classes:
C23C16/46; H01L21/22
Foreign References:
| JPH1116893A | 1999-01-22 | |||
| JPH1022290A | 1998-01-23 | |||
| JPS63277779A | 1988-11-15 | |||
| JP2003100643A | 2003-04-04 | |||
| JP2008034780A | 2008-02-14 |
Attorney, Agent or Firm:
OHYAMA, HIROAKI (JP)
Hiroaki Oyama (JP)
Hiroaki Oyama (JP)
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