Title:
HEAT TREATMENT BOAT FOR VERTICAL HEAT TREATMENT FURNACE AND HEAT TREATMENT METHOD FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2022/137851
Kind Code:
A1
Abstract:
Provided are a heat treatment boat for a vertical heat treatment furnace and a heat treatment method for a semiconductor wafer that, during heat treatment of a semiconductor wafer, can suppress occurrence of slip displacement in a semiconductor wafer more than was conventionally possible. This heat treatment boat for a vertical heat treatment furnace comprises a plurality of columns and one or more support sections that are connected to the plurality of columns and support a rear surface of a semiconductor wafer, wherein the heat treatment boat is characterized in that when a region that includes a central axis O of the heat treatment boat and is sandwiched between two planes P1, P2 abutting the column 11 is referred to as a first region A1 and a region outside the first region A1 is referred to as a second region A2, with regard to one or more columns 11 among the plurality of columns, the support section 11a connected to the column 11 supports the rear surface of the semiconductor wafer in the second region A2.
Inventors:
TAKATA KOUSUKE (JP)
YUKIMOTO YASUSHI (JP)
KUSABA TATSUMI (JP)
SHIMIZU AKIHIKO (JP)
YUKIMOTO YASUSHI (JP)
KUSABA TATSUMI (JP)
SHIMIZU AKIHIKO (JP)
Application Number:
PCT/JP2021/041052
Publication Date:
June 30, 2022
Filing Date:
November 08, 2021
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/22; H01L21/324; H01L21/683
Foreign References:
| JP2004200271A | 2004-07-15 | |||
| JP2004014985A | 2004-01-15 | |||
| JP2000232151A | 2000-08-22 | |||
| JP2000100739A | 2000-04-07 | |||
| JP2018137318A | 2018-08-30 | |||
| JP2002324830A | 2002-11-08 | |||
| JP2004363273A | 2004-12-24 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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