Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT TREATMENT DEVICE, HEAT TREATMENT METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/142958
Kind Code:
A1
Abstract:
A heat treatment device (21) comprises: a laser oscillation unit (1) that oscillates a laser beam (L); a stage that retains an irradiation object (31) to be irradiated with the laser beam (L); an optical system (2) that guides the laser beam (L) oscillated from the laser oscillation unit (1) to the irradiation object (31); and a movement unit that relatively changes the positional relationship between the optical system (2) and the irradiation object (31). The heat treatment device (21) also comprises: a detection unit (9) that detects the power of first reflected light (R1) generated when the laser beam (L) is reflected by the surface of the irradiation object (31); and a determination unit (10) that determines, on the basis of a detection value of the power of the first reflected light (R1) detected by the detection unit (9), whether there is a change in the surface temperature in a region of the irradiation object (31) which was irradiated with the laser beam (L).

Inventors:
MONODANE TAKESHI (JP)
KAWASE YUSUKE (JP)
MINAMITAKE HARUHIKO (JP)
TATSUMI HIROAKI (JP)
KANADA KAZUNORI (JP)
Application Number:
PCT/JP2018/001452
Publication Date:
August 09, 2018
Filing Date:
January 18, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/268; C21D1/34; G01K11/12
Foreign References:
JP5590925B22014-09-17
JPH09102468A1997-04-15
JP2010093159A2010-04-22
JP2003138314A2003-05-14
JP2002359194A2002-12-13
JP2014525141A2014-09-25
JP2014212178A2014-11-13
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
Download PDF: