Title:
HEAT TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2001/035453
Kind Code:
A1
Abstract:
A film forming device, comprising a treating furnace, gas feeding means feeding treating gas into the processing furnace, heating means heating the inside of the treating furnace to a specified treating temperature, and a normal pressure exhaust system for exhausting the gas inside the treating furnace at a specified exhaust pressure near the atmospheric pressure, the normal pressure exhaust system further comprising a flow-adjustable and pressure-adjustable valve, wherein the exhaust pressure of the normal pressure exhaust system is detected by a pressure sensor, and a control part controls the valve based on the pressure detected by the pressure sensor, whereby a stable control is allowed without requiring the introduction of the atmosphere or inert gas, and the structure of the exhaust system is simplified so as to reduce the cost of the entire device.
Inventors:
SAITO YUKIMASA (JP)
Application Number:
PCT/JP2000/007886
Publication Date:
May 17, 2001
Filing Date:
November 09, 2000
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SAITO YUKIMASA (JP)
SAITO YUKIMASA (JP)
International Classes:
F27D19/00; C23C16/44; F27B5/04; F27B5/18; H01L21/00; H01L21/22; H01L21/31; (IPC1-7): H01L21/31; H01L21/205
Foreign References:
| JPH08139085A | 1996-05-31 | |||
| JPH11233505A | 1999-08-27 | |||
| JPH0758032A | 1995-03-03 | |||
| JPH0626248U | 1994-04-08 |
Other References:
See also references of EP 1235262A4
Attorney, Agent or Firm:
Sato, Kazuo (Fuji Bldg. 2-3 Marunouchi 3-chome Chiyoda-ku, Tokyo, JP)
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