HEAT TREATMENT DEVICE

WIPO Patent Application WO/2005/124840

A1

A heat treatment device capable of suppressing the occurrence of particles even if a treated body is thermally extended/retracted while highly maintaining the uniformity of the in-plane temperature of the heat treated body. A support means (36) supporting the treated body (W) in a treatment container (6) comprises at least three support pin parts (46) supporting the treated body (W) by coming into contact with the rear surface peripheral part of the treated body (W), and the area of the tip contact surface (46B) of the support pin part (46) in contact with the treated body (W) is within the range of 0.07 to 0.64 mm².

JP2003523070	INDUSTRIAL APPLICABILITY: Method for manufacturing a thin-layer structure and manufacturing apparatus
WO/2002/011187	METHOD AND APPARATUS FOR DEPOSITING A TANTALUM-CONTAINING LAYER ON A SUBSTRATE
JPH06196539	SIMULATION METHOD FOR ION IMPLANTATION PROCESS

KASAI SHIGERU (JP)
TANAKA SUMI (JP)
SUZUKI KOUKI (JP)
KATSUKI JIRO (JP)
MURAOKA SUNAO (JP)

PCT/JP2005/011052

December 29, 2005

June 16, 2005

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TOKYO ELECTRON LTD (JP)
KASAI SHIGERU (JP)
TANAKA SUMI (JP)
SUZUKI KOUKI (JP)
KATSUKI JIRO (JP)
MURAOKA SUNAO (JP)

H01L21/00; H01L21/205; H01L21/22; H01L21/26; H01L21/68; H01L21/687; (IPC1-7): H01L21/26; H01L21/205; H01L21/22; H01L21/68

JPS59121832A	1984-07-14
JPH02139935A	1990-05-29
JP2003525524A	2003-08-26
JPH11145025A	1999-05-28
JPH11283929A	1999-10-15
JPH07176472A	1995-07-14

Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)

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